2.5D IC Packaging Market Trends, Growth, Price and Forecasts To 2024
2.5D IC Packaging Market - Global Industry Analysi
Publicado el en “Diseño, Negocios”, Idioma — English. 3 páginas.
Lower cost, low power consumption, high speed signal processing and small form factors are some of the prime reasons behind the growing application of 2.5D packaging in smartphone and memory chips. Additionally, high thermal performance is another major feature which is fueling the market for 2.5D integrated circuit packaging globally. Más
