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Reports-

Advanced Packaging Market Growth

Publicado no e em "Negócios, Negócios", idioma — English. 8 páginas.
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level Mais
Market analysis is provided for global market including development trends by regions, types and competitive analysis Mais
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