3D IC and TSV Interconnect Market by 2016 at CAGR of 16.9%
Feb. 2014
Publié sur dans “Business, Science”, langue – English. 2 pages.
The recent report of marketsandMarkets about 3D IC Market forecast that the 3D IC market is expected to reach $6.55 billion by end of 2016 at a CAGR of 16.9%, Followed by North America 35% and Asia is observed to hold the highest share of around 40%. Plus
