3D IC and TSV Interconnect Market by 2016 at CAGR of 16.9% Feb. 2014 点击阅读
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3D IC and TSV Interconnect Market by 2016 at CAGR of 16.9%

Feb. 2014

出版日期 / “商业, 科学” / 语言—English / 2页
The recent report of marketsandMarkets about 3D IC Market forecast that the 3D IC market is expected to reach $6.55 billion by end of 2016 at a CAGR of 16.9%, Followed by North America 35% and Asia is observed to hold the highest share of around 40%. 更多
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