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QYR Market Research

Global Flip Chip Bonder market research

Опубликовано в "Бизнес, Общий", язык - English. 5 страниц.
The global Flip Chip Bonder market is expected to reach $445.06 million by 2022 from $245.25 million in 2017, growing at a CAGR of 12.66% from 2017 to 2022. And China market is expected to be the biggest market with sales market share of 25.67% in 2022. https://www.qyresearch.com/index/detail/66164/global-flip-chip-bonder-sales-market Еще
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