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QYR Market Research

Global Flip Chip Bonder market research

出版日期 / “商业, 综合” / 语言—English / 5页
The global Flip Chip Bonder market is expected to reach $445.06 million by 2022 from $245.25 million in 2017, growing at a CAGR of 12.66% from 2017 to 2022. And China market is expected to be the biggest market with sales market share of 25.67% in 2022. https://www.qyresearch.com/index/detail/66164/global-flip-chip-bonder-sales-market 更多
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